AIDC Material Solutions - Ningbo Jintian Copper (Group) Co., Ltd.

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As GPU power consumption keeps rising, liquid cooling has become a must, and the computing power bottleneck is shifting from chip shortages to power and cooling shortages. High-performance, high-power AIDC servers use about 5 to 10 times more copper than traditional servers, and copper's strategic importance keeps growing. For the full-chain construction of AI computing centers, Jintian Copper’s materials are widely used in three core areas: power transmission systems, signal transmission systems, and cooling systems, meeting the needs for high-current power supply, high-speed signal interconnect, and high-density liquid cooling in high-power AI servers.

Application Scenarios

Power Transmission System

For high-power power supply scenarios in AI computing centers, it meets the needs of high current and heavy-load power supply, ensuring stable and reliable power.

Core application scenarios: UPS, HVDC, BBU, power supplies, distribution, racks, transformers, etc.
Signal Transfer System

Focusing on high-speed signal connections inside servers, achieving low-latency, low-loss transmission, and ensuring stable high-bandwidth, high-speed data exchange.

Key application scenarios: PCIe, DDR, orthogonal backplanes, DAC direct-connect copper cables, etc.
Thermal‑Cooling System

Adapted for kilowatt-level high-power GPU clusters, covering temperature control needs at all levels—from chip, module, and rack, to the entire data center—improving energy efficiency.

Core application scenarios: heat pipes, VC cold plates, 3D VC, liquid cooling plates, liquid cooling quick connectors, CDU heat exchange units, cooling towers, etc.